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Description
- Layer count:1-36 layers
- Material: fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco
- Copper thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz
- Board thickness: 8-236mil(0.2-6.0mm)
- Min.line width/space: 3/3 mil(75/75um)
- Min. drill size: 8 mil(0.2mm)
- Min. HDI laser drill size: 3 mil(0.067mm)
- Tolerance of hole size: 2 mil(0.05mm)
- PTH copper thickness: 1 mil(25 um)
- Solder mask color: Green,blue,yellow,white,black,red
- Peelable solder mask: Yes
- Surface treating: HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION, TIN,FLASH GOLD
- Gold thickness: 2-30u” (0.05-0.76um)
- Blind hole/buried hole: Yes
- V-cut: Yes
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